SEMICON Taiwan 2022 has kicked off in Taipei and will run through September 16, with this year's theme focusing on automotive chips, heterogeneous integration, and other semiconductor...
The newly released Apple Watch Ultra is widely believed to take on Garmin in the smartwatch market, and Taiwan's leading OSAT ASE Technology is gearing up to render backend support...
Third-generation compound semiconductors such as SiC and GaN are very crucial to the future development of electrical vehicles (EV) and green power industries, and heterogeneous integration...
Taiwan-based AP Memory Technology, a Powerchip Technology subsidiary specializing in customized DRAM memory designs and IPs, expects its gross margin to pick up in the third and fourth...
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
China-based Sanan Integrated Circuit (SAIC), a compound semiconductor specialist under Sanan Optoelectronics Group, is actively developing itself into an RF IDM to support the country's...
Taiwan-based AP Memory Technology, specializing in customized memory chip designs and IPs, expects its 2022 revenues to grow further on strong shipments of its AI memory solutions...
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
