Taiwan-based suppliers of smartphone solutions, LCD driver ICs, analog and power management (PWM) chips, are expected to post double-digit sequential revenue growth in the second...

With more device vendors developing their chip solutions in-house, as well as China pushing for self-sufficiency in semiconductors, demand for custom ASIC chips has been growing substantially,...

Himax technologies has decided to exercise its options to fully acquire Emza Visual Sense for an undisclosed sum, according to the Taiwan-based IC design house. The transaction is...

Global TDDI (touch and display driver integration) chip shipments are expected to hit the five million mark in 2018, Digitimes Research estimates.

Taiwan IC designers will see their shipments of TDDI (touch with display driver integration) chips and fingerprint recognition chips sustain growth momentum in 2018, but looming price-cutting...

Himax Technologies has presented Android smartphone samples equipped with the company's 3D sensing total solution at the 2018 Mobile World Congress in Barcelona. The solution is ready...

Taiwan LCD driver IC designers are aggressively diversifying their product lines to counter the declining presence of domestic TFT LCD panel makers in the global market, and will...

Taiwan-based fabless IC firm Himax Technologies has announced the acquisition of certain advanced nano 3D masters manufacturing assets and related intellectual property and business...

3D sensing is expected to replace fingerprint sensing as mainstream for smartphones in 2018 with more smartphone vendors, including Huawei, Xiaomi Technology and Oppo, expected to...

With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...

Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...

China-based vendors Oppo and Xiaomi Technology will adopt 3D sensing solutions for smartphones to be launched in 2018, with such solutions to be developed by Himax Technologies via...

Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...