Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Himax Technologies has expressed optimism about the growth prospects for its non-driver IC business, most notably with its structure light integrated solution for 3D sensing and wafer-level...
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Taiwan-based IC backend houses, particularly those engaged in the supply chain for Apple's upcoming iPhones, are expected to see their revenues start peaking for 2017 in August or...
Demand for TDDI (touch with display driver integration) chips is set to boom starting the third quarter of 2017 which will buoy sales at related backend companies including Chipbond...
Taiwan-based IC design houses have seen customer orders pick up on seasonality with some expected to post sequential revenue growth of 10% or more in the third quarter, according...
Himax Technologies announced recently it had made a strategic investment in cash in exchange for a 45.1% equity ownership of Emza Visual Sense, with a one-year option to acquire the...
Taiwan-based Himax Technologies will be among the component suppliers of Apple for its OLED iPhone that will feature a built-in 3D-sensing module to enable augmented reality (AR)...
One year after announcing mass shipments of liquid crystal on silicon (LCOS) microdisplays and wafer-level optics (WLO) products for augmented reality (AR) applications, Himax Technologies...
LCD driver IC specialist Himax Technologies expects to post a revenue decrease of 18-25% sequentially in the first quarter of 2017, due mainly to seasonal factors such as fewer working...
Himax Imaging, a subsidiary of Himax Technologies, has announced the HM5530 UltraSenseIR product, a low-power and low-noise 5.5-megapixel backside-illuminated (BSI) CMOS image sensor...
MagnaChip Semiconductor has begun volume production for power management chips designed by Himax Technologies using MagnaChip's specialty 0.18-micron BCD process, according to the...
