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NEWS TAGGED HPC
Monday 13 June 2022
Notebook prospects vary with device models, supply chain segments
As a whole, the notebook market has seen a reversal in demand, with consumer models bearing the brunt of sales downturn. Shipments of education-use Chromebooks, which played a pioneering...
Friday 10 June 2022
ASE gearing up for server, HPC chip boom
ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.
Wednesday 8 June 2022
TSMC reiterates 30% growth goal for 2022, citing surging demand from auto, HPC sectors
TSMC is unwavering in its goal of reaching 30% revenue growth by US dollars in 2022, as demand for automotive and high-performance computing (HPC) chips remains high, according to...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Tuesday 7 June 2022
Taiwan-based IC testing firms maintain positive outlook for 2022
Taiwan-based IC testing firms expect to enjoy strong demand for high-end testing driven by network chips, high-performance computing (HPC) solutions, power management ICs (PMIC),...
Monday 6 June 2022
Taiwanese cooling module makers turn to making VCs for HPC
Cooling module maker Auras Technology and Nidec Chaun-Choung Technology (CCI) are both turning their focuses to producing vapor chambers (VCs) for HPC and high-end notebook products,...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Tuesday 31 May 2022
High-end IC testing demand to stay robust in 2H22
Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...
Tuesday 31 May 2022
Diode, MCU suppliers ramping up for high-speed transmission, HPC, automotive applications
Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and...
Tuesday 31 May 2022
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Thursday 26 May 2022
Concerns rising over potential foundry overcapacity in 2024
Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Tuesday 24 May 2022
Metaverse, ESG in spotlight at Computex 2022
Computex 2022 has kicked off in Taipei, with the focus this year on the metaverse, ESG (environmental, social, and governance), high-performance computing (HPC), AI, and 5G-related...