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NEWS TAGGED HPC
Monday 15 May 2023
Co-packaged optics market to grow sharply on AI/ML advancement
The overall data communication optics market is expected to grow sharply in the next decade, driven by the ever-larger dataset of AI and machine learning (ML) models, with co-packaged...
Monday 8 May 2023
Nan Ya sees 1Q23 profit fall to 8-quarter low
Nan Ya PCB, among Taiwan's major ABF substrate suppliers, saw its net profits hit an eight-quarter low of NT$2.325 billion (US$75.8 million) in the first quarter of 2023. EPS for...
Friday 5 May 2023
AP Memory to expand AI memory biz
AP Memory Technology, which specializes in customized IoT RAM and other DRAM memory, will extend its AI memory business by entering the HPC area, according to company president Wen...
Tuesday 2 May 2023
Ansys multiphysics solutions certified for TSMC's N2 process
Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology.
Thursday 27 April 2023
TSMC talks about enhanced N3E and other 3nm variants
At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.
Friday 21 April 2023
eMemory security-enhanced OTP qualifies on TSMC N5
NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
Thursday 20 April 2023
TSMC sees another revenue drop in 2Q23
TSMC expects its second-quarter revenue in US dollar terms to register a sequential decline of 6.7% at the midpoint, with gross margin and operating margin estimated at 52–54%...
Tuesday 18 April 2023
System-level testing demand rising; TSMC, Intel, and other foundries are in
System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...
Tuesday 18 April 2023
Samsung sees 12-inch fab capacity utilization rise to 90% on stable 5/4nm process yields
Samsung Electronics has seen its 12-inch wafer fab capacity utilization rise to 90% in the second quarter from 80% registered a quarter earlier, driven by stable 5/4nm process performance...
Friday 14 April 2023
South Korea sees larger semiconductor export decline than Taiwan in March
South Korea's March semiconductor exports slipped 34.5% on year amid sluggish market demand, and Taiwan also failed to stay unscathed but with a lower export decline of only 13.4%...
Friday 31 March 2023
Packaging substrate demand remains promising
The outlook of mid- to long-term demand for substrates supporting the packaging of HPC chips remains bright despite recent speculation that the market for related substrates is ove...
Thursday 30 March 2023
HPC applications most promising future outlet for IC designers in Taiwan
Taiwan's IC design industry has reached a critical crossroads, with an unclear development direction, worsening talent shortage, confusing government policies, and shrinking academic...
Monday 27 March 2023
Geopolitical situation between US and China affects HPC market vibes
With the rise of OpenAI's ChatGPT and Baidu's Ernie Bot, the prospects of the high-performance computing (HPC) chip market look good. However, the HPC chip delivery situation has...
Friday 24 March 2023
WinWay remains focused on HPC chip demand
WinWay Technology, a provider of IC test interface solutions, remains focused on high-performance computing (HPC) chip demand and has rolled out wafer-level co-packaged optics (CPO)...
Tuesday 14 March 2023
Chenbro Micom expects revenue to grow quarter by quarter
Server chassis maker Chenbro Micom will see its revenue grow quarter by quarter in 2023, thanks to a gradual pick-up in demand for AI servers and data centers, according to the Taiwan-based...