With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Chenbro Micom has expressed optimism about demand for AI servers powered by multiple processors in the second half of 2023. With demand for multi-GPU servers rising, the installation...
AI has not only become the most important keyword in the entire tech industry but also driven major cloud service providers to gear up efforts to develop their own computing chips...
The global semiconductor industry market situation in the second half of 2022 was badly affected by inflation, which resulted in a significant drop in growth rate. It's estimated...
WinWay Technology, a provider of IC test interface solutions, saw its May revenue climb nearly 60% sequentially, buoyed by a surge in orders for AI and HPC chips.
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
Taiwan's leading IC substrate maker Unimicron Technology will invest NT$30 billion (US$981.03 million) to set up a new plant in Taiwan dedicated to production of IC substrates with...
Computex Taipei 2023 officially began on May 30. Besides a speech from Nvidia CEO and founder Jensen Huang, who is riding the AI wave, Taipei Computer Association (TCA) and AUO chairman...
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Sources say Samsung Electronics is establishing a hyperscale data center for storage and analysis of the statistical data collected in semiconductor processes. Big data analysis and...
EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...
TSMC will see the baseline 3nm process technology (N3B) dominate 90% of its N3 family capacity in 2023, and nearly 90% of the N3B capacity reportedly has been booked by Apple for...
