Taiwan-based silicon IP provider M31 Technology has benefited significantly from semiconductor self-supply campaign in China, with the ratio of revenues contributed by Chinese clients...

Nvidia is expected to advance the rollout of a downgraded version of its AI chips, dubbed AI 800, for shipments to Chinese clients in response to restrictions on its China-bound sales...

Taiwan-based IC substrate suppliers are expected to continue ramping up their capital expenditures (capex) next year to build additional production capacities for ABF substrates,...

In a meeting with analysts and media, MediaTek CEO Rick Tsai pointed out that the IC design house will concentrate investment on three focuses in the future, namely high performance,...

Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV...

SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.

Progate Group Corporation (PGC), which is among TSMC's design ecosystem partners, has expressed optimism about its operations in 2023 and will start to trade its shares on the Taipei...

AMD will utilize TSMC's CoWoS packaging for the next generation of its datacenter accelerators, according to industry sources.

High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...

For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...

Taiwan-based IC substrate specialists Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology are poised to generate sequential revenue increases in the fourth quarter...

Backend house Powertech Technology (PTI) expects its capex for 2023 to be about 40% lower than this year's level estimated at NT$17 billion.

The US government launched a new series of control of semiconductor export to China earlier in October - the move is expected to limit the country in designing and obtaining high-performance...

TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...

TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...