In a keynote speech at the 2023 International Conference on Computer-Aided Design (ICCAD) in Guangzhou, China, Wei Shaojun, who is Vice President of the China Semiconductor Industry...
Taiwan Semiconductor Manufacturing Company (TSMC) reported robust performance for its October revenue, totaling NT$243.23 billion (US$7.52 billion), up 34.8% from September, thanks...
As the semiconductor industry goes through a downturn period due to the excessive orders during the pandemic and the subsequent inventory adjustment, WinWay Technology, a semiconductor...
Despite the semiconductor industry's current downturn, competition in the HPC chip sector remains fierce. According to findings from DIGITIMES Research, the first half of 2023 saw...
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
The three primary high-performance computing (HPC) chip suppliers, Intel, AMD, and Nvidia, will likely see their sales strengthen quarter by quarter in the second half of 2023, buoyed...
The recent update to the US government's chip ban has raised concerns about its potential impact on Chinese chipmakers, particularly in the realm of high-performance computing (HPC)...
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
Generative AI has driven the demand for high-performance computing (HPC) and high-speed transmission, which in turn is adding development momentum to silicon photonics optical communication...
SiFive, Inc., a pioneering force in RISC-V computing, has unveiled a pair of groundbreaking products to cater to the ever-growing demands of high-performance computing. The new SiFive...
Although major Taiwan-based OSATs experienced a decline in total revenue for 2023 through September, market sources state that they are gearing up for an anticipated rise in demand...
Taiwanese IC design firms are expected to increase their market share in consumer applications, as their European and American counterparts continue to withdraw from markets such...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...