At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
The inaugural Quantum Taiwan Forum, held on the opening day of SEMICON Taiwan 2023 running September 6–8 at the Taipei Nangang Exhibition Center, gathered experts from Fujitsu,...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
With the rapidly rising popularity of generative AI, high bandwidth memory (HBM) and graphics processing units (GPU) have become highly sought-after components. However, as the semiconductor...
A surge in AI server chip demand cannot offset the overall slump in consumer electronics demand, causing TSMC to cut its revenue growth forecast for 2023 to a 10% drop. However, market...
Taiwan's OSATs and foundry TSMC that boasts testing capacity have refrained from making the expected purchases of new wafer probers and automated testing equipment (ATE) from major...
Testing house King Yuan Electronics (KYEC) continues to see sluggish demand for handset SoCs, despite robust demand for HPC processors, according to industry sources.
Tai-Tech Advanced Electronics, a power inductor specialist, recently announced plans to establish a new plant in Johor Bahru, Malaysia for the production of automotive electronics...
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
As it is becoming much more difficult and expensive to pack more transistors into a single chip, the chip industry pins its hope on chiplet technology when the global demand for HPC...
