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NEWS TAGGED HPC
Monday 7 February 2022
MediaTek readies growth roadmaps for next three years
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
Friday 28 January 2022
Samsung foundry revenue sets record high in 4Q21
Samsung Electronics has reported consolidated revenue climbed to a record high of KRW76.57 trillion (US$63.65 billion) in the fourth quarter of 2021, when its foundry business posted...
Monday 24 January 2022
TSMC reportedly to build new advanced packaging fab in southern Taiwan
TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...
Tuesday 18 January 2022
PC processor prices poised to rise in 2022
PC processor prices are poised to rise substantially in 2022 to reflect rising foundry costs; processors fabricated using sub-7nm process nodes are particularly likely to rise in...
Friday 14 January 2022
TSMC expects up to 29% sales growth in 2022
TSMC expects to see its 2022 revenue in US dollar terms increase 25-29% on year, outperforming the industry average.
Thursday 13 January 2022
TSMC expects 7.4% sales growth in 1Q22
TSMC expects to post revenues of between US$16.6 billion and US$17.2 billion in the first quarter of 2022, which is a 7.4% sequential increase at the midpoint. Gross margin and operating...
Thursday 13 January 2022
What motivates TSMC to spend big on capacity expansion
TSMC's planned US$100 billion in capex from 2021 to 2023 will not be sufficient to carry out its capacity expansion projects in Taiwan and overseas, market observers believe. The...
Tuesday 11 January 2022
OLED DDI demand to boom for handset, automotive applications in 2022
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
Monday 10 January 2022
Lead times for high-end SoC testers extend to over 6 months, says Advantest
It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
Thursday 6 January 2022
Taiwan OSAT, test interface vendors upbeat about demand for new processors
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Monday 3 January 2022
Bullish sales not to be seen in all IC supply chains in 2022
Bullish performance seen across all semiconductor segments and players in almost the past two years will no longer remain in 2022, as chip demand will vary from segment to segment...
Wednesday 29 December 2021
Fan-out packaging demand to grow for mobile chips
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Tuesday 28 December 2021
Semco reportedly to build new ABF substrate capacity in Vietnam to serve Intel
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Friday 24 December 2021
Molding compounds to see worst crunch among packaging materials in 2022
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...