Despite facing various regulatory restrictions from the US, the Chinese IC industry has not changed its goal of achieving semiconductor autonomy. In terms of IC design, many Chinese...
IC test interface specialist WinWay Technology expects a stronger second half of 2023 than the first, buoyed by demand for AI and HPC device applications.
In response to the advent of the AI era, Samsung Electronics is gearing up to strengthen its semiconductor ecosystem, and has further announced that it will expand the provision of...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
European IDMs differ slightly from their US counterparts in terms of manufacturing capacity deployments, focusing more on expanding wafer fab capacity than backend packaging and testing...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...
The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...
Taiwan-based IC test interface specialist WinWay, who has been engaged in serving HPC customers, is expected to see its capacity from two new plants in Taiwan ready in two years to...
The datacenter supply chain is facing two conflicting forces that may persist for 2-3 quarters and lead to a single-digit decline in global server shipment scale in 2023. One is the...
With proliferating AI applications and ever-rising demand for HPC (high performance computing), high-efficiency cooling solutions are gaining importance in dissipating heat resulting...
Apaq Technology, a specialist in solid electrolytic capacitors, anticipates that its operations will start to improve in the second half of 2023, as cloud, HPC, edge servers and EV...
Taiwanese foundries, OSATs, and other chipmakers are bracing for a surge in demand for AI high-performance computing (HPC) processors from US-based fabless vendors, such as Advanced...
