China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
JCET posted net profit of CNY0.48 billion in the third quarter, up 24% on quarter.
According to JCET, the company has focused on key advanced packaging applications this year, continuously improving its overall solution capabilities for application scenarios, optimizing production capacity layout, and further strengthening its position in the global IC packaging and test industry.
JCET has made significant strides in a number of industries, including wide bandgap power devices, high-performance computing (HPC), 5G communications, and automotive electronics. With the market for electric vehicles, for example, quickly developing, JCET has been able to capitalize on market prospects, the China-based OSAT indicated.
During the first three quarters of 2023, JCET's sales from the automotive electronics sector soared by 88% year on year, according to the company. By providing R&D and HVM services to clients worldwide, the OSAT has further strengthened its leadership position in areas such as radio frequency front end modules, RF power amplifiers, and antenna in package (AiP) modules in the 5G communications sector, it continued.
JCET stated that the company is stepping up its efforts with customers in the AI and HPC domains for advanced packaging solution development and product introductions, accelerating market expansion in high-computation systems, power management, high-performance storage, and smart terminals by leveraging high-density heterogeneous SiP technologies and advantageous global manufacturing layouts.
In the power semiconductor market, JCET's high-density integration solutions for wide bandgap power devices, developed in conjunction with global customers, are widely used in automotive and industrial energy storage, the OSAT said.
JCET is committed to developing technical innovation, investing CNY1.08 billion in R&D in the first three quarters of 2023, a 10.4% increase year on year, according to the OSAT. The company continues to promote the construction of high-performance package manufacturing facilities, as well as the conversion of existing factories to advanced packaging technologies.
In addition, by enhancing inventory control and supply chain management, JCET guarantees the continued high efficiency of its operations, it claimed.
"In recent years, JCET, by focusing on high-performance advanced packaging technologies, has made breakthrough progress in collaboration with major customers on the high-end chip business and achieved significant quarter-on-quarter growth in performance for the third quarter of this year," said company CEO Li Zheng in a statement. "The company will seize new opportunities arising from the restructuring of the global industrial chain and will continue to promote the healthy development of IC back-end manufacturing."
