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Tuesday 5 July 2022
Nan Ya to boost automotive IC substrate sales in 2022
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Friday 24 June 2022
Foxconn expands IC backend biz through affiliates
Foxconn Technology (Hon Hai Precision Industry) has been expanding its IC backend business through subsidiaries, such as ShunSin Technology and Qingdao KoreSemi, according to industry...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Wednesday 25 May 2022
Manpower crunch becoming new normal for semiconductor sector, says ASE chair
Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Friday 25 March 2022
Advanced packaging technology outlook, 2020-2026

Introduction

Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Wednesday 23 February 2022
Unimicron to merge with SiP substrate specialist
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Wednesday 23 February 2022
ASE eyeing backend orders for Apple-designed 5G modem chips
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Friday 11 February 2022
ASE expects auto chip backend biz to hit over US$1 billion in 2022
Taiwan's leading OSAT ASE Technology expects revenues from backend services for automotive chips to break a landmark level of US$1 billion in 2022 after growing 60% on year in 2021...
Wednesday 5 January 2022
Micro-packaging demand for ESD chips to grow robustly
ESD (electrostatic discharge) protection components have become increasingly crucial peripheral chips for handset and metaverse devices, spurring great demand for micro-packaging...
Friday 10 December 2021
Taiwan IC substrate makers poised to enjoy strong 4Q21
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are all poised to see their revenues peak for 2021 in the fourth quarter thanks to strong shipments for fulfilling...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...