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Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Thursday 16 September 2021
Backend firms to see strong 5G RF module demand for iPad mini 6
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Wednesday 8 September 2021
Kinsus to enjoy sales growth through 4Q21
IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Monday 30 August 2021
BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22
BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 18 August 2021
Shennan Circuits to build production capacity for ABF substrates
China-based PCB maker Shennan Circuits has disclosed plans to invest a total of CNY6 billion (US$925.3 million) in building production lines for ABF substrates, making it the first...
Friday 13 August 2021
IC shortage to remain challenging in 2022, says ASE
A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.
Friday 13 August 2021
ASE, ShunSin poised to embrace growing SiP demand
OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
Tuesday 3 August 2021
China PCB maker DSBJ to step into IC substrate market
China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...
Wednesday 28 July 2021
IC substrate maker Kinsus posts 2-fold profit jump in 2Q21
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...