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Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Thursday 31 December 2020
Customized IC sockets in hot demand for SiP, SLT applications
Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration,...
Tuesday 29 December 2020
Merry Electronics deepening presence in TWS earbuds market
Taiwan-based acoustic solutions specialist Merry Electronics, now in the supply chain for Apple's AirPods, is gearing up to deepen its deployments also in the non-Apple TWS (true...
Friday 25 December 2020
Taiwan IC substrate makers doing well in China market
Taiwan's IC substrate makers Unmicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have seen their production lines in China running at full capacity to serve Chinese...
Tuesday 8 December 2020
Xintec, ShunSin see robust backend orders
Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
Friday 20 November 2020
Shunsin to start commercial runs at new Vietnam plants in 2021
Backend house ShunSin Technology, a subsidiary of Foxconn Technology, is set to start commercial production at its new plants in Vietnam 2021, mainly to fulfill orders from US clients,...
Monday 16 November 2020
ASE quietly enhancing CIS backend capability
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
Monday 9 November 2020
Top foundries to maintain tight partnerships with OSATs, says Amkor executive
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
Thursday 29 October 2020
IC substrate maker Kinsus to see revenue peak in 4Q20
IC substrate maker Kinsus Interconnect Technology is set to see its revenues peak for 2020 in the fourth quarter, buoyed by shipments for new iPhones, according to market sources.
Monday 26 October 2020
Taiwan makers urged to build high-end IC substrate ecosystem
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
Tuesday 20 October 2020
Chipbond, OSE form alliance for flash, 5G RF modules packaging
Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic...
Friday 16 October 2020
IC substrate suppliers eyeing strong SiP demand for AirPods
The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to...
Friday 16 October 2020
Quartz component demand for AirPods to grow robustly in 2021
Apple reportedly will have its next-generation AirPods series all adopt system-in-package (SiP) technology, which will significantly boost overall quartz component demand for the...
Thursday 15 October 2020
ASE provides SiP packaging for Apple-designed UWB chip
Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...
Thursday 8 October 2020
Nan Ya PCB, Kinsus post record revenues for 3Q20
IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...