OSAT ASE Technology has launched MicroSiP packaging solutions designed specifically for TWS earbuds and other wearable devices, according to industry sources.

OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...

Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...

With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.

Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...

IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.

IC substrate maker Kinsus Interconnect Technology is expected to post sequential revenue increases through the fourth quarter of 2021, buoyed by strong ABF and BT based substrate...

Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...

ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...

BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset...

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...

China-based PCB maker Shennan Circuits has disclosed plans to invest a total of CNY6 billion (US$925.3 million) in building production lines for ABF substrates, making it the first...

A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.

OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...

China's PCB maker Dongshan Precision Manufacturing (DSBJ) has disclosed plans to invest CNY1.5 billion (US$232.1 million) in establishing a new wholly-owned subsidiary that will be...