With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Taiwan's testing and inspection equipment vendor Test Research (TRI) is optimistic its 2021 business results will be better than 2020, driven by strong equipment demand for 5G, notebook...
The supply of BT substrates has been increasingly tight, as more vendors of chips, particularly cryptomining ASICs, have turned to adopt BT substrates amid worsening shortages of...
Backend house Powertech Technology (PTI) and along with its logic IC packaging subsidiary Greatek Electronics have seen clear order visibility through the third quarter of 2021, with...
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Taiwan's PCB makers in the supply chain of AirPods are prepared to kick off mass production of flexible PCB (FPCB) and SiP substrates for the third-generation AirPods slated to be...
Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...
Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second...
IC substrate maker LG Innotek is bracing for production of ABF-based FCBGA substrates, according to Korean media reports, but industry sources believe it would be a hard job to venture...
Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
ASE Technology Holding will see its wire-bonding capacity run at full utilization and remain short of demand through the end of 2021, and up to 90% of clients have signed two-year...
Taiwan-based IC substrate makers are generally cautious about expanding BT-based substrate capacity. Nevertheless, with demand for SiP (system-in-package) and AiP (antenna-in-package)...
