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NEWS TAGGED OSAT
Friday 8 May 2026
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
Thursday 7 May 2026
Chinese semiconductor equipment makers deepen SEA OSAT presence
Chinese semiconductor equipment makers CCtech and Nextool Technology are expanding into Southeast Asia's OSAT hubs as Malaysia and Singapore emerge as key packaging and testing centers...
Wednesday 6 May 2026
India approves new semiconductor and Mini/Micro LED projects
India's latest approvals could expand global display and chip sourcing as the country adds Mini/Micro LED GaN fabrication and large-scale packaging capacity. Global manufacturers and...
Monday 4 May 2026
India roundup: India accelerates AI, semiconductor, and manufacturing push with major investments and startup bets

India's technology ecosystem is seeing rapid expansion across AI infrastructure, semiconductors,...

Thursday 30 April 2026
ASE Technology sees seasonality fade as AI demand drives steady 2026 growth
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
Thursday 30 April 2026
Amkor advances data center CPU mass production amid manageable supply and cost risks
Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...
Wednesday 29 April 2026
China OSAT leader JCET expands in advanced packaging, profit climbs
China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
Wednesday 29 April 2026
Memory test capacity stays high as substrate prices may rise in 2Q26
The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly...
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
Friday 24 April 2026
Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
Friday 17 April 2026
Taiwan's OSAT expansion could tighten global test capacity and raise costs
Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
Tuesday 14 April 2026
JCET CEO sees robotics extending automotive semiconductor growth

China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

Tuesday 14 April 2026
JCET advances CPO, glass substrates to capture AI packaging demand
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...