The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Kaynes SemiCon secured India's first paying OSAT customer for advanced semiconductor packaging and inaugurated an EMS facility. Foxconn clarified the yields of made-in-India iPhones...
Taiwan-based OSAT, ASE, signed a tentative contract with the government of Kitakyushu in Kyushu, Japan, to buy land in Kitakyushu's Wakamatsu-ku where they would attempt to expand...
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
According to a corporate filing, Indian electronics manufacturing services (EMS) provider Kaynes Technology has inaugurated a new manufacturing facility in Hyderabad. The plant opened...
Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer...
As Micron and Tata Group's large semiconductor projects are under construction in Gujarat, India-based startup Suchi Semicon has announced its plan to begin providing OSAT (Outsourced...
Taiwan-based IC backend firms are optimistic about the overall recovery in the market in the second half of this year, with particular focus on the robust demand for AI processors,...
The global semiconductor market is experiencing strain as inventory adjustments across the electronics sector weigh heavily on growth. According to DIGITIMES Research, the...
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
