CONNECT WITH US
NEWS TAGGED OSAT
Friday 26 July 2024
TSMC Foundry 2.0 illustrates growing importance of IC backend, says ASEH
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
Wednesday 17 July 2024
HBM4 poised to revolutionize memory performance in HPC applications
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
Wednesday 17 July 2024
OSATs stepping up capex
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
Tuesday 9 July 2024
Indian startup and semiconductor titans team up to bridge skill gap
When Raghu Panicker, the CEO of Kaynes Semicon (a 100% subsidiary of Kaynes Technology), decided it was time to fill more critical positions as his company expanded toward its goals...
Monday 8 July 2024
Taiwan OSATs poised to rebound on robust AI, HPC chip demand
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
Friday 5 July 2024
Equipment manufacturers resume discussions on FOPLP with TSMC as the lead
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
Thursday 27 June 2024
ASEH steps up production expansion for advanced packaging
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
Tuesday 25 June 2024
Taiwan OSATs to see sales growth in 2H24
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...
Friday 21 June 2024
Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Friday 14 June 2024
AI chip vendors approach OSATs for possible FOPLP support
Fan-out panel-level (FOPLP) packaging is gaining attention from semiconductor firms seeking extra capacity support, and two AI chip companies are in talks with OSATs about potential...
Monday 3 June 2024
SPIL invests US$1.276 billion to build facility in Penang, Malaysia
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Wednesday 22 May 2024
Kaynes Tech expects OSAT business to begin operation in two years
Amid the investment hype among India-based companies in the semiconductor field, Kaynes Technologies said its OSAT project witnessed delays due to the ongoing elections in India,...
Monday 6 May 2024
Southeast Asia and Japan attract OSAT interest amid geopolitical diversification
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
Monday 29 April 2024
KYEC leaves China amid OSAT shift toward Southeast Asia
King Yuan Electronics (KYEC) decided to sell its assets in China, another Taiwan-based OSAT major leaving China, as the US-China geopolitical tensions are reshaping the OSAT indust...
Thursday 25 April 2024
India-based Kaynes eyes advanced packaging and CPO in OSAT foray
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...