Taiwan-based IC backend firms are optimistic about the overall recovery in the market in the second half of this year, with particular focus on the robust demand for AI processors,...
The global semiconductor market is experiencing strain as inventory adjustments across the electronics sector weigh heavily on growth. According to DIGITIMES Research, the...
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
When Raghu Panicker, the CEO of Kaynes Semicon (a 100% subsidiary of Kaynes Technology), decided it was time to fill more critical positions as his company expanded toward its goals...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
As Apple prepares to launch its first AI smartphone in September, the third quarter is expected to see a surge in stocking demand. This has not only pushed TSMC's market value to...
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Fan-out panel-level (FOPLP) packaging is gaining attention from semiconductor firms seeking extra capacity support, and two AI chip companies are in talks with OSATs about potential...
