India's ASIP Technologies, which has partnered with the South Korean company APACT, has said it is close to receiving government approvals for its OSAT facility. This comes after...

After India approved three chip projects to develop a local chipmaking ecosystem, an Indian government official disclosed the country is likely to see at least 2-3 wafer fabs and...

Amid the global geopolitical tension and an indigenization endeavor, China has seen an outflow of investments in the chip packaging and test industry when a series of Taiwan-based...

Kaynes SemiCon, a subsidiary of the Indian EMS Kaynes Technology, has entered into a strategic partnership with Recynergy Technology, a Taiwan-based company specializing in semiconductor...

Taiwan-based Aptos Technology, a subsidiary of Taiwan Mask, announced a collaboration with India-based Kaynes Semicon Private Limited on training and technology licensing in semiconductor...

ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...

OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.

OSATs ASE Holdings (ASEH) and Jiangsu Changjiang Electronics Technology (JCET) are both looking to capitalize on the AI market potential.

As geopolitical concerns rise, many backend companies have chosen Malaysia as a new base for plant expansions, according to industry sources.

Foxconn and HCL signed an MoU to form a joint venture into the OSAT sector, as manufacturers are capitalizing on the opportunity to have a presence in the Indian semiconductor ecos...

Days after the formation of a joint venture by the HCL Group and Foxconn, the duo is reportedly scouring for places for their OSAT venture in the southern states of Tamil Nadu and...

After the chip foundry Joint Venture (JV) formed by Foxconn and Vedanta fell apart, the former announced a new JV with India-based IT giant HCL group to enter the OSAT sector.

According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.

IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.

Backend house Powertech Technology (PTI) expects to increase its 2024 capex to more than NT$10 billion (US$321 million), up from NT$7-8 billion in 2023, as it eyes growth opportunities...