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NEWS TAGGED IC PACKAGING
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Thursday 28 March 2024
IC packaging materials distributor Niching sees brisk order visibility
Niching Industrial has observed clear order visibility for vapor chambers and silver paste materials.
Wednesday 27 March 2024
China Resource pays CNY11.6 billion to gain full control of JCET
The buyer behind the change of controlling interest in Jiangsu Changjiang Electronics Tech (JCET), the world's third-largest IC packaging and testing company and the largest in Mainland...
Wednesday 27 March 2024
IC packaging materials supplier CWE obtains NT$3 billion syndicated loan
Chang Wah Electromaterials (CWE) has signed a five-year syndicated loan agreement for NT$3 billion (US$94 million) with 12 local banks in Taiwan, according to the semiconductor materials...
Monday 25 March 2024
IC packaging and testing suppliers coping with electricity price hike
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Wednesday 31 January 2024
Logic IC packaging house Greatek expects growth in 2024
Greatek Electronics, a Powertech Technology (PTI) group company specializing in consumer logic IC packaging, expects the market to recover in 2024.
Friday 26 January 2024
Backend firm Lingsen reportedly in Humane Ai Pin supply chain
Backend house Lingsen Precision Industries reportedly has entered the supply chain for US startup Humane's Ai Pin, according to industry sources.
Friday 19 January 2024
Wah Lee sees strong materials demand for advanced packaging, AI
Materials distributor Wah Lee Industrial is upbeat about demand supporting advanced chip manufacturing and AI applications.
Thursday 18 January 2024
Advanced packaging continues to boost high-end material demand
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
Thursday 28 December 2023
IC packaging material distributors expect brisk orders in 2024
As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific,...
Tuesday 19 December 2023
Why would China send GPUs to Malaysia for advanced packaging?
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Thursday 30 November 2023
IC backend houses see promising chiplet demand
Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.
Thursday 16 November 2023
Semiconductor materials distributor Topco expands global market footprint
Semiconductor materials distributor Topco Scientific has followed in the footsteps of its foundry partners by establishing operations overseas, according to Jeffery Pan, chairman...
Wednesday 15 November 2023
IC packaging material distributors see demand pick up
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research