Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon.
Advanced Semiconductor Engineering (ASE) plans to expand its factory site in Malaysia with total investment estimated at US$300 million, according to the outsourced semiconductor...
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
IC packaging leadframe and other materials demand is expected to hit bottom in the first quarter of 2023 and start recovering, according to industry sources.
Taiwan-based OSAT ASE Technology has reported September revenue grew 4.5% sequentially to a record high of NT$66.65 billion (US$2.09 billion), while revenue at memory backend specialist...
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
IC packaging leadframe demand is expected to fall further in the fourth quarter of 2022 and shows no signs of recovery, as inventory adjustments for commodity chips are taking longer...
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Taiwan's OSATs remain uncertain about the arrival of orders from Nvidia and AMD for processing their new GPU chips, and are expected to see their high-end packaging and testing capacities...
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang.
Taiwan-based IC packaging and testing houses expect new restrictions imposed by the US to cut China off from high-end artificial intelligence (AI) chips will have a limited impact...
