TSMC saw its revenue hit a record high for the second consecutive month in January.

MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...

Samsung Electronics has reported consolidated revenue climbed to a record high of KRW76.57 trillion (US$63.65 billion) in the fourth quarter of 2021, when its foundry business posted...

TSMC reportedly is planning to build a new advanced packaging plant in Chiayi or Yunlin county, southern Taiwan as it is fast revising its production roadmaps in response to rapid...

PC processor prices are poised to rise substantially in 2022 to reflect rising foundry costs; processors fabricated using sub-7nm process nodes are particularly likely to rise in...

TSMC expects to see its 2022 revenue in US dollar terms increase 25-29% on year, outperforming the industry average.

TSMC expects to post revenues of between US$16.6 billion and US$17.2 billion in the first quarter of 2022, which is a 7.4% sequential increase at the midpoint. Gross margin and operating...

TSMC's planned US$100 billion in capex from 2021 to 2023 will not be sufficient to carry out its capacity expansion projects in Taiwan and overseas, market observers believe. The...

OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...

It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...

Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...

Bullish performance seen across all semiconductor segments and players in almost the past two years will no longer remain in 2022, as chip demand will vary from segment to segment...

Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...

IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...

Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...