Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Ibiden has announced plans to inject JPY180 billion (US$1.66 billion) into the expansion of production capacity for high-end IC substrates for applications such as servers and image...
Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Tight supply for ABF substrates may ease in 2023 at the earliest if makers in Taiwan, Japan and Korea can smoothly commercialize their new capacity with stable yield rates in 2022...
The global supply of ABF substrates may fall short of demand by at least 25% in 2021, due mainly to limited capacity expansions despite increasing demand, according to industry sou...
With Taiwan sustaining its firm leadership in the global PCB industry, China has been fast catching up due to its heavy capital expenses over the past five years, and PCB makers in...
TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...
Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...
Unimicron Technology's board of directors has resolved to allocate NT$17.4 billion (US$594.2 million) in capex for 2021, with over 90% of the sum and the majority of another budget...
SLP (substrate-like PCBs) makers in the supply chain of Apple devices have ended their first wave of competition, with Taiwan's Zhen Ding Technology and Austria's AT&S each absorbing...