If Taiwan does not have enough power supply, the semiconductor and Artificial Intelligence (AI) industries will not stay in Taiwan, commented Kuo Jyh-Huei, the new minister of economic...
As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy,...
Skymizer, a prominent Taiwan-based AI system software provider known for its compiler optimization solutions, has announced the release of EdgeThought, its new software-hardware co-design...
Nvidia CEO Jensen Huang revealed two months ago, at a dinner party for Taiwanese partners in Silicon Valley, that he considers himself Taiwan's ambassador. Taiwan is positioned as...
NVIDIA's latest financial report for the first quarter of fiscal year 2025 (February to April 2024) revealed record-breaking revenue for its data center division. Following a record-setting...
The Chinese semiconductor industry, including the CMOS Image Sensor (CIS) segment, is finding more room for development in the domestic market with the sudden rise of the Chinese...
The new head of Samsung Electronics Co.'s semiconductor division urged employees to work their way past challenges in the business, making his first remarks to staff after the surprise...
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
US semiconductor manufacturer Coherent is facing the potential closure or sale of its 29,000-square-meter wafer fab in Newton Aycliffe, County Durham, UK.
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
