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Friday 24 May 2024
CSIA executive urges China chip industry to forget about advanced nodes and focus on tangible victory
While the media is still buzzing about Huawei joining hands with Semiconductor Manufacturing International (SMIC) to manufacture advanced process 7nm and even 5nm chips, on the same...
Friday 24 May 2024
Biden moves to secure Chips Act funding for Kenya's Ruto
The US is proposing to make Kenya the first country in Africa to benefit from funding in the Chips and Science Act, according to White House officials, underscoring the countries'...
Friday 24 May 2024
Toshiba completes new 300mm fab for power semiconductors
Toshiba Electronic Devices & Storage recently hosted a ceremony to commemorate the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an...
Friday 24 May 2024
Do Samsung Semiconductor's leadership issues stem from its 'return' talent appointment rule?
With Jun Young-hyun coming in as a "relief pitcher" to take over as the head of the semiconductor and Device Solutions (DS) division, the South Korean industry pointed out that there...
Friday 24 May 2024
Absolics becomes first materials firm to get US CHIPS Act subsidy
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
Friday 24 May 2024
Samsung and SK Hynix increase R&D and facility investment in 1Q24
Samsung Electronics and SK Hynix's research and development expenses and facility investments for the first quarter of 2024 were higher than those in the first quarter of 2023. It...
Friday 24 May 2024
TSMC obtains permanent VEU license for Nanjing fab from US
The US Department of Commerce on March 23 issued a validated end-user (VEU) license to TSMC Nanjing, replacing the previous temporary exemption given in October 2022, according to...
Friday 24 May 2024
Probe card provider MPI sees production capacity fully utilized
Semiconductor probe card supplier MJC Probe (MPI) has fully utilized its production capacity, anticipating a stronger second half than the first half.
Friday 24 May 2024
AI becomes the key to new paradigm shifts and how TSMC responds to new era
Since the turn of the century in the year 2000, the changes brought to the world by digital technology and the Internet can be roughly categorized into four phases. The first phase...
Friday 24 May 2024
TSMC 3nm chip output to rise over 300% in 2024, says fab director
TSMC is scaling up its 3nm chip output, which in 2024 will be over three times that of 2023, according to Y. K. Hwang, company senior director for Fab 18B.
Thursday 23 May 2024
South Korea sets aside record US$19 billion to fuel chipmaking
South Korea has unveiled a $19 billion package of incentives to bolster its chip sector, a boon to Samsung Electronics Co. and SK Hynix Inc. as they race to stay ahead in an increasingly...
Thursday 23 May 2024
China conducts major military drills around Taiwan, but local market resilient
In a bold display of military might, China initiated extensive drills encircling Taiwan on May 23, a clear signal to the newly inaugurated Taiwanese president, Lai Ching-te. The exercises,...
Thursday 23 May 2024
Taiwan to share Science Park management know-how with friendly countries
Cheng-wen Wu, Minister of the National Science and Technology Council (NSTC), said that Taiwan would be happy to share and transfer the experience of science park management to other...
Thursday 23 May 2024
US tariff hike on Chinese EVs, batteries, steel to take effect on August 1
The first group of China-made products that the US Biden administration targets will see their tariffs rise on August 1, 2024, according to an announcement from the Office of the...
Thursday 23 May 2024
Exploring the Synergy of Nanoelectronics, AI, and Quantum: Interview with General Chair of IEEE INEC 2025
IEEE INEC, which stands for IEEE International Nanoelectronics Conference, was initiated in 2006 when the field of nanoelectronics was emerging and will host its 2025 conference in...