LG Electronics (LGE), ambitiously eyeing the emerging markets, has placed orders with Arima Communications for at least 12 new 2.5G handsets, with shipments to reach as many as 10...
STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...
With MediaTek announcing that it is sampling its 3G WCDMA solution with customers at the end of 2008, the company joins the competition in the global 3G handset chipset market with...
The new iPhone 3G sports an evolutionary design that favors cost reduction instead of cutting-edge features, supporting Apple's goal of expanding its market share and achieving a...
With increasing IDM orders from vendors including STMicroelectronics, Infineon and NXP Semiconductors, as well as clients in Europe, IC testing house King Yuan Electronics Company...
