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    Glass substrate technology gains traction for advanced packaging by 2026
    2min ago
    Chinese MacBook bearing supplier hit by quality issues, orders shift to US, Taiwan
    8min ago
    Winbond reportedly wins Apple orders, potentially dividing GigaDevice market share
    Sep 18, 20:52
    IC materials distributors upbeat about 2025
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    Sep 18, 20:33
    Panel maker EDT sees diversification bear fruit in 2025
    Sep 18, 20:02
    Luxshare closing car assembly market gap with Foxconn
    Sep 18, 19:59
    Chinese bearing supplier for new MacBook halts shipments on quality concerns
    Sep 18, 19:45
    Wellysun enters car market targeting auto intelligence
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    NEWS TAGGED INNOVATIONS
    Wednesday 15 January 2020
    Semiconductor firms showcase innovations at Nepcon Japan 2020
    Nepcon Japan 2020 runs from January 15-17 in Tokyo with exhibitors showcasing their latest IC innovations covering packaging technologies, materials, equipment, sensors and PCBs for...
    9/9 pages
    CPC
    BIZ FOCUS
    Sep 18, 11:23
    LitePoint embraces new opportunities for growth with innovative wireless testing solutions
    Friday 13 September 2024
    Henkel Adhesives helps customers unlock growth for next-generation advanced packaging
    Thursday 12 September 2024
    Importance of cloud threat modeling for business security
    Thursday 12 September 2024
    Three-in-one charger developed by ASUS IoT helps TIDC realize vision for smart parking
    Summary of Tech Supply Chain News!
    RESEARCH INSIGHTS
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
    Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research