Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
L&T Semiconductor Technologies is on its way to bag IC design orders in the booming Indian semiconductor market. India's wearable shipments fell for the first time amid a lack...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
L&T Semiconductor Technologies, an Indian startup set up less than a year ago, expects to begin developing chips for six automobile companies and eventually venture into the chipmaking...
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
TPK, a leading panel manufacturer, reported a substantial improvement in its financial performance for the second quarter of 2024. The company narrowed its core business losses to...
As Foxconn revealed its second-quarter results in Taiwan on August 14, its chairman, Young Liu, visited India to meet with Indian Prime Minister Narendra Modi for the second time...
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...
SK Hynix has reportedly begun procuring production equipment for its M16 plant in Icheon, aiming to boost its monthly production capacity from 100,000 to 180,000 units, an increase...
Wistron has reported its strongest second quarter in gross margin and EPS, boosted by strong AI server shipments. The ODM's outstanding performance during the quarter confirms the...
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Nvidia has encountered engineering obstacles in developing two next-gen advanced chips, slowing down the product release pace that would expand its leading position in the AI computing...
