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Thursday 4 March 2010
Companies say operations not affected by 6.4 earthquake in southern Taiwan
An earthquake measuring 6.4 on the Richter scale hit a mountainous region in southern Taiwan earlier this morning, causing injuries, damaging buildings and disrupting transportation...
Monday 1 March 2010
SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Thursday 11 February 2010
Chipbond sees January 2010 sales up 24% on month
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Wednesday 27 January 2010
Driver IC backend supply to tighten, says Chipbond chairman
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Tuesday 26 January 2010
Chipbond capex to more than double in 2010
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
Wednesday 20 January 2010
Chipbond, IST merger may complete ahead of schedule
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
Wednesday 13 January 2010
LCD driver IC backend houses considering raising quotes
LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...
Monday 28 December 2009
Chipbond-IST merger set to complete in June 2010
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Thursday 17 December 2009
Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
Tuesday 8 December 2009
IST merger to further lighten non-operating investment burden for Compal
The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...
Monday 7 December 2009
Chipbond and IST announce merger
Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.
Wednesday 2 December 2009
Chipbond, IST deny merger rumors
LCD driver IC packaging and testing houses Chipbond Technology and International Semiconductor Technology (IST) have both dismissed recent rumors that the two companies plan to merge...
Thursday 19 November 2009
One too many LCD driver IC backend service providers in Taiwan, says Chipbond
Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...
Friday 6 November 2009
Driver IC backend supplier revenues down in October 2009
Driver IC backend supplier Chipbond Technology saw its October revenues decline by 25.2% to NT$468 million (US$13.39 million) as customers have slowed down their pace of orders, according...
Thursday 5 November 2009
Chipbond and IST 4Q09 revenues to drop 20% on quarter
Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...