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NEWS TAGGED JCET
Monday 22 August 2022
JCET not optimistic about business prospects for 2H22
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
Wednesday 17 August 2022
Chinese IC industry counts on chiplet to mitigate US sanctions
As US sanctions continue to intensify, China's semiconductor industry has been looking for ways to bypass the curbs. Chiplet, a modular approach of chip design that integrates multiple...
Tuesday 2 August 2022
Competition heats up for advanced packaging among OSATs in Taiwan and China
In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Thursday 8 July 2021
China OSATs step up deployments in advanced packaging field
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
Thursday 2 July 2020
China top-3 OSAT firms to see combined revenues rise 8% in 2020, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
Monday 6 April 2020
China revving up IC backend equipment development
China is expanding its semiconductor equipment self-sufficiency, with homegrown makers stepping up development of wet process and high-end back-end packaging equipment to serve domestic...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Monday 21 October 2019
Kingsemi debuts on China STAR market
Semiconductor equipment supplier Kingsemi started trading its shares on the science and technology innovation board (STAR) of China's Shanghai Stock Exchange (SSE) October 21.
Thursday 5 September 2019
Major China OSAT firms post losses for 1H19
Major China-based outsourced semiconductor assembly and test (OSAT) providers Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have both reported...
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Friday 22 March 2019
Spirox, ShibaSoku team up
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
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Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research