Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
China is expanding its semiconductor equipment self-sufficiency, with homegrown makers stepping up development of wet process and high-end back-end packaging equipment to serve domestic...
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Semiconductor equipment supplier Kingsemi started trading its shares on the science and technology innovation board (STAR) of China's Shanghai Stock Exchange (SSE) October 21.
Major China-based outsourced semiconductor assembly and test (OSAT) providers Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have both reported...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...
