China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
IC testing company Sigurd Microelectronics has announced plans to acquire 100% of Singapore-based Bloomeria Limited, which will allow the Taiwan-based company to also obtain a more...
Speculation has emerged that Mong-song Liang, formerly a senior director of R&D at Taiwan Semiconductor Manufacturing Company (TSMC) advanced modules technology division, will...
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...
The performance of STATS ChipPAC still has been lower than expected in recent quarters following its acquisition by China-based Jiangsu Changjiang Electronics Technology for US$780...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
China-based IC packaging and testing houses are vying for more orders, particularly those requiring advanced technologies, from Taiwan-based IC design houses, according to industry...
A recent media report indicating that China-based Jiangsu Changjing Electronics Technology (JCET) has landed SiP (system-in-package) module orders from Apple could serve as a warning...
Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...
Major China-based IC backend houses including Jiangsu Changjiang Electronics Technology and Nantong Fujitsu Microelectronics have obtained orders from Qualcomm and MediaTek, which...
