Semiconductor Manufacturing International (SMIC), China's Shaoxing government and Shengyang Group have formed a joint venture named Semiconductor Manufacturing Electronics (Shaoxin...
IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...
Qualcomm and Universal Scientific Industrial (Shanghai), a subsidiary of Advanced Semiconductor Engineering, have signed an agreement to form a joint venture in Sao Paulo. This joint...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has obtained financial support from the government to accelerate the development of its 14nm and more...
Compal Electronics saw the revenue proportion for PC products slip from over 70% in the past to 68% in 2017 and expects the percentage to further drop to 65% in 2018, as shipments...
The New Kinpo Group is planning to establish lights-out factories in Thailand and the Philippines in 2018 and is looking to build another in Thailand in 2019 to help save manual labor,...
LED epitaxial wafer and chip maker Epistar will see its stake in Kaistar Lighting (Xiamen), its joint-venture in southeastern China, decrease as a result of new investment from others,...
Gigabyte Technology has reportedly partnered with touch panel maker TPK Holding to establish a joint venture for obtaining orders from the artificial intelligence (AI) and Internet...
Taiwan-based Lite-On Technology will team up with China's Tsinghua Unigroup to jointly develop the China market for storage products such as solid state drives (SSD), with the latter...
Wind power generation developer Swancor Renewable Energy has announced the establishment of a joint venture with TIPC Marine, a wholly-owned subsidiary of state-run seaport operator...
Taiwan's Investment Commission has approved an application filed by United Microelectronics (UMC) to indirectly inject a total of US$600 million into the pure-play foundry's new 12-inch...
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Taiwan-based Teco Electric & Machinery has disclosed it will establish a joint venture (JV) for investments in generating green energy with local financial holding companies.
After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...
Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...
