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Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Wednesday 13 September 2017
Gigabyte motherboard shipments to fall under 13 million units in 2017
Gigabyte Technology is expected to see its motherboard shipments fall under 13 million units in 2017 from 16-17 million units in 2016, and could struggle to maintain the 10 million...
Friday 1 September 2017
Acer to supply VR equipment for Dubai theme park
Acer has recently formed a partnership with a virtual reality (VR) theme park in Dubai, the UAE with the construction to be completed by the end of 2017 or in early 2018, according...
Tuesday 29 August 2017
E-paper startup Linfiny to focus on e-notebook development
EPD (electrophoretic display) e-paper startup Linfiny, a joint venture between E Ink Holdings (EIH) and Sony Semiconductor Solutions, will officially kick off its operations in the...
Tuesday 22 August 2017
Compal reportedly to sell stake in China JV soon
Compal Electronics has started to relocate its executives at LCFC (Hefei) Electronics Technology - the notebook manufacturing joint venture between the ODM and Lenovo - back to the...
Friday 18 August 2017
Dialog looking to extend partnership with Spreadtrum
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Wednesday 16 August 2017
Toshiba says court order will not affect memory operations
Toshiba has been ordered by a US court to resume Western Digital's access to certain Toshiba's databases, but this order will not affect the operations of its memory chip unit - Toshiba...
Tuesday 15 August 2017
SPIL to invest US$25 million in China
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Tuesday 15 August 2017
Powerchip posts EPS of NT$1.59 for 1H17
Contract chipmaker Powerchip Technology has announced net profits increased 17.6% on year to NT$3.63 billion (US$119.7 million) in the first half of 2017. EPS for the six-month period...
Monday 14 August 2017
ChipMOS to enter production for 3D sensing components in 3Q17, says report
Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Monday 14 August 2017
GCS optimistic about VCSEL demand for data centers
Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has expressed optimism about gallium arsenide (GaAs) demand for vertical cavity surface-emitting...
Thursday 10 August 2017
ChipMOS obtains backend orders from Novatek
ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...
Friday 28 July 2017
ChipMOS Shanghai obtains backend orders for NOR flash from XMC
ChipMOS Technologies (Shanghai), a joint venture between Taiwan-based ChipMOS and Tsinghua Unigroup, has obtained backend orders for NOR flash memory from Wuhan Xinxin Semiconductor...
Wednesday 26 July 2017
Inventec reports losses for subsidiary TPV-Inventa
Inventec has announced it has stopped collecting accounts receivable from its subsidiary TPV-Inventa in order to write off TPV-Inventa's bad debts of around CNY11 million (US$1.66...
Tuesday 25 July 2017
Kinsus net profits fall 82% in 1H17
IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research