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Thursday 16 November 2017
Samsung huge chip capex for 2017 shows move to defend its memory dominance
After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...
Tuesday 14 November 2017
Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion
Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...
Friday 10 November 2017
Compal close to ink deal to sell Lienpal stake to Lenovo
Compal Electronics is in the final stage of talks to sell its entire holdings in Lienpal (Hefei), a notebook manufacturing joint venture between Compal and Lenovo, to its China-based...
Tuesday 7 November 2017
Kinsus posts record October revenues
IC substrate supplier Kinsus Interconnect Technology saw its October revenues climb to a record high of NT$2.48 billion (US$82.3 million).
Wednesday 1 November 2017
Kinsus 1Q-3Q17 net profits fall
IC substrate supplier Kinsus Interconnect Technology has reported net profits of NT$476 million (US$15.8 million) for the first three quarters of 2017, down 72.7% on year, with EPS...
Tuesday 24 October 2017
Acer steps up financing of StarVR joint venture
Starbreeze AB and Acer have announced that a new capitalization plan has been agreed for the StarVR - the joint venture for marketing and sales of the StarVR Virtual Reality (VR)...
Tuesday 24 October 2017
Aleees constructing new plant in China
Taiwan-based electric bus brand and cathode material supplier Aleees has broken ground on production facilities belonging to its joint venture in Guizhou, China that will begin to...
Monday 23 October 2017
HPE-Foxconn server JV dissolved
A joint-venture server company established three years ago by Hewlett Packard Enterprise (HPE) and Foxconn Group (Hon Hai) has reportedly been quietly dissolved recently due to the...
Wednesday 18 October 2017
Motech sets up PV module joint venture
Solar cell maker Motech Industries has announced the establishment of a PV module firm, Taiwan Solar Module Manufacturing Corp. (TSMMC), on a joint venture basis with PV conductive...
Tuesday 17 October 2017
Linde LienHwa making new gas production investments in Taiwan
Linde LienHwa, a joint venture between the Germany-based Linde Group and Taiwan-based LienHwa Industrial, is a manufacturer of bulk and electronic specialty gases used during the...
Thursday 12 October 2017
Pure-play foundries boosting presence in China
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Wednesday 13 September 2017
Gigabyte motherboard shipments to fall under 13 million units in 2017
Gigabyte Technology is expected to see its motherboard shipments fall under 13 million units in 2017 from 16-17 million units in 2016, and could struggle to maintain the 10 million...
Friday 1 September 2017
Acer to supply VR equipment for Dubai theme park
Acer has recently formed a partnership with a virtual reality (VR) theme park in Dubai, the UAE with the construction to be completed by the end of 2017 or in early 2018, according...
Tuesday 29 August 2017
E-paper startup Linfiny to focus on e-notebook development
EPD (electrophoretic display) e-paper startup Linfiny, a joint venture between E Ink Holdings (EIH) and Sony Semiconductor Solutions, will officially kick off its operations in the...