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NEWS TAGGED KAOHSIUNG
Wednesday 3 October 2018
ASE gearing up for FOPLP
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half...
Wednesday 3 October 2018
Winbond starts constructing new 12-inch fab
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
Friday 7 September 2018
Iteq August revenues up, Taiflex down
Copper-clad laminate (CCL) supplier Iteq has announced consolidated revenues of NT$2.09 billion (US$67.8 million) for August 2018, up 9.2% on year and 4.4% sequentially.
Tuesday 28 August 2018
Powerchip to build 2 new 12-inch fabs in Taiwan
Pure-play foundry Powerchip Technology has disclosed plans to construct two new 12-inch wafer fabs in Taiwan with total investment estimated at NT$278 billion (US$9.05 billion).
Monday 20 August 2018
Winbond board approves NT$20 billion for new 12-inch plant establishment
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Monday 30 July 2018
Winbond profits hit 17-year high in 2Q18
Taiwan-based Winbond Electronics, a supplier of specialty DRAM and flash memory, saw its net profits surge to a 17-year high of NT$2.16 billion (US$70.4 million) in the second quarter...
Wednesday 18 July 2018
Winbond completes NT$10 billion bond issue
Winbond Electronics has completed the sale of NT$10 billion (US$327.2 million) worth of secured corporate bonds in Taiwan, according to the maker of specialty DRAM and flash memory...
Friday 22 June 2018
ASE Industrial striving for diversification
ASE Industrial holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), will be diversifying its offerings to satisfy growing...
Tuesday 12 June 2018
Winbond to break ground for new fab in southern Taiwan
DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.
Tuesday 3 April 2018
ASE breaks ground for new factory in southern Taiwan
Advanced Semiconductor Engineering (ASE), a provider of semiconductor assembly and test services, on April 3 held a groundbreaking ceremony at the site of its K25 building in the...
Friday 2 March 2018
Global PCB industry output value increases 11.7% in 2017, says TPCA
The worldwide PCB industry output value grew 11.7% to US$65 billion in 2017, according to data compiled by Taiwan Printed Circuit Association (TPCA). The on-year growth was the highest...
Wednesday 17 January 2018
Southern Taiwan Science Park to see revenues break NT$1 trillion mark soon
The annual revenues scored by firms operating in the Southern Taiwan Science Park (STSP) are expected to break the NT$1 trillion (US$33.84 billion) in the near future, as Taiwan Semiconductor...
Monday 18 December 2017
Medical device, material makers cluster in Kaohsiung Science Park
Kaohsiung Science Park (KSP) under the Southern Taiwan Science Park (STSP) has become a cluster of medical device and material makers in Taiwan, with 73 enterprises stationed there,...
Wednesday 27 September 2017
Winbond to break ground on new 12-inch fab in mid-2018
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Wednesday 13 September 2017
Merck sets up IC materials R&D center in southern Taiwan
Merck has inaugurated its first IC materials application R&D center in Asia, which will be located in Kaohsiung, southern Taiwan. More than EUR2.8 million (US$3.35 million) will...