Taiwan-based CPU IP provider Andes expects to see shipments of its silicon IP chips hit the 800 million mark in 2018, according to company president Frankwell JM Lin.
Macronix International has announced that STMicroelectronics is using Macronix International's 8-bit I/O serial NOR flash memory for ST's new STM32L4+ microcontroller discovery kits...
Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money, according...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is scheduled to enter volume production of chips fabricated using 28nm HKMG and HKMG+ processes in the...
After securing orders from STMicroelectronics, Globalfoundries' 22nm FD-SOI (22FDX) process is being evaluated by hundreds of potential customers looking to use a more advanced fully-depleted...
X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the...
Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...
Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...
AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries,...
Samsung Foundry will soon be ready to enter mass production of magnetoresistive random-access memory (MRAM) chips built using 28nm fully depleted silicon-on-insulator (FD-SOI) process...
Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...
Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...
Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...
