CONNECT WITH US
Out in Front
Sponsored
NEWS TAGGED LOW-POWER
Friday 18 August 2017
Dialog looking to extend partnership with Spreadtrum
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Monday 17 July 2017
Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
Friday 14 July 2017
Faraday unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD controller
Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...
Thursday 6 July 2017
Wireless charging demand promising: Q&A with Dialog CEO Jalal Bagherli
As a global leader in providing rapid charging solutions, Dialog Semiconductor has demonstrated its prowess in power management for smartphones and other applications. But the market...
Thursday 29 June 2017
MediaTek unveils NB-IoT SoC, partnership with China Mobile
MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...
Thursday 22 June 2017
Samsung mass producing Exynos-branded IoT solution
Samsung Electronics has announced the start of mass production of its first Exynos-branded IoT solution, the Exynos i T200.
Thursday 22 June 2017
Faraday MFP ASIC shipments rise at CAGR of 38%
Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
Tuesday 20 June 2017
Handset IC sales to top total personal computing in 2017, says IC Insights
The ongoing slump in shipments of standard PCs along with the drop-off in tablets are setting the stage for handset IC sales to finally surpass IC revenues in total personal computing...
Monday 19 June 2017
Global Unichip rolls out HBM2 total solution
Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...
Monday 19 June 2017
MediaTek to hire 1,000 staff in 2017, says co-CEO
MediaTek will recruit an additional 1,000 employees in 2017, said newly-appointed co-CEO Rick Tsai at the company's general shareholders meeting recently.
Monday 12 June 2017
Packaging can extend physical limits of semiconductors, says TSMC chair
Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...
Friday 2 June 2017
PTI optimistic about memory-dominated packaging
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Thursday 1 June 2017
MediaTek launches next-gen Wi-Fi chipset portfolio for IoT
MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
Thursday 1 June 2017
DRAM market to remain oligopoly over next 3 years, says Nanya president
The global DRAM market will remain an oligopoly of three large firms over the next three years, according to Pei-Ing Lee, president for Taiwan-based Nanya Technology.
Tuesday 25 April 2017
TSMC talks about its next growth drivers
Taiwan Semiconductor Manufacturing Company (TSMC) is seeing robust growth in demand from the mobile computing, automotive electronics, IoT and high-performance computing sectors,...