Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
With memory chipmakers ready to scale up output, industry sources indicated that backend houses are optimistic about orders from the memory sector beginning in the second quarter...
Zhou Meisheng, former EVP of technology R&D at Semiconductor Manufacturing International (SMIC), has joined Chinese DRAM manufacturer ChangXin Memory Technologies (CXMT).
Wuhan Xinxin Semiconductor Manufacturing (XMC) reportedly has sent out an invitation to bid for a high-bandwidth memory (HBM) project. This suggests that the Chinese memory sector,...
SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development:...
Taiwan's AI startup DeepMentor has teamed up with memory giant Phison Electronics to edge training servers for training large-scale language models (LLM).
Samsung Electronics is reportedly accelerating automation innovation in its production lines to cope with the memory market downturn and labor shortages. By using manufacturing equipment...
Micron Technology unveiled at MWC 2024 that the forthcoming flagship smartphones from Honor and Samsung will feature the company's Universal Flash Storage (UFS) 4.0 mobile flash storage...
Micron Technology has begun volume production of its HBM3E memory. Nvidia H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024, will include Micron's...
