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Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Tuesday 1 October 2024
Memory contract price rally to slow in 4Q24
Memory contract prices are expected to continue their rally in the fourth quarter of 2024, albeit at a slower pace, according to market sources.
Tuesday 1 October 2024
SK Hynix advances 16-layer HBM3E to maintain market lead
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Tuesday 1 October 2024
Samsung delays Taylor and Pyeongtaek fab construction amid global semiconductor slowdown
Samsung Electronics has reportedly delayed construction and equipment orders for its Pyeongtaek Phase 4 (P4) plant in South Korea and its second facility (T2) in Taylor, Texas. This...
Tuesday 1 October 2024
Micron sees explosive AI PC growth, customers stockpile memory inventories
Micron CEO Sanjay Mehrotra recently shared insights into the AI-powered PC market from a memory provider's perspective during the company's latest earnings call. He highlighted the...
Monday 30 September 2024
South Korea's chip stockpiles shrink at fastest pace since 2009
South Korea's semiconductor stockpiles dwindled at the fastest clip since 2009 last month in a sign of sustained demand for high-performance memory chips used in artificial intelligence...
Monday 30 September 2024
Micron's HBM capacity full until 2025, poised for multi-billion dollar revenue boost
The explosive growth of artificial intelligence (AI) has fueled a surge in demand for data centers, with Micron projecting the high-bandwidth memory (HBM) market to surpass US$25...
Monday 30 September 2024
Weekly news roundup: TSMC, Micron struggle to compete with local Japanese giants for talent; China's mature chip dominance looms for Taiwan's IC design houses
These are the most-read DIGITIMES Asia stories in the week of September 23 – September 27.
Monday 30 September 2024
HBM oversupply looms as Samsung seeks Nvidia validation for HBM3E
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Friday 27 September 2024
Semiconductor talent crunch: TSMC, Micron struggle to compete with Japan's homegrown giants
Amid rising geopolitical tensions, the global semiconductor sector is witnessing an intense chip war across multiple regions, with a critical shortage of skilled talent emerging as...
Friday 27 September 2024
Memory spot prices fall on slow demand recovery
The recovery in downstream consumer markets remains sluggish, leading to a further decline in spot market prices for memory chips. In response, industry leader Kingston Technology...
Thursday 26 September 2024
Thailand to build first SiC facility, with operation expected by 2027
Thailand is set to make a significant stride in the semiconductor industry with the establishment of its first silicon carbide (SiC) wafer factory, which is expected to begin operation...
Thursday 26 September 2024
South Korea's semiconductor sector struggles amid severe talent shortage
Despite AI-driven growth in the semiconductor industry, South Korea is facing a critical shortage of skilled workers. A preference among students for medical degrees and aggressive...
Thursday 26 September 2024
SK Hynix begins volume production of the world's first 12-Layer HBM3E
SK Hynix Inc. announced today that it has begun mass production of the world's first 12-layer HBM3E product with 36GB name="_ednref1"...
Thursday 26 September 2024
SK Hynix begins volume production of 12-layer HBM3E
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research