CONNECT WITH US
NEWS TAGGED MEMORY CHIPS
Wednesday 27 March 2024
SK Hynix reportedly planning new packaging facility for HBM in the US
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Wednesday 27 March 2024
Memory module house Innodisk bullish about 2024 growth
Industrial memory module specialist Innodisk has voiced optimism about its operations in 2024, citing solid demand for AI device applications.

According to Randy Chien,...
Wednesday 27 March 2024
South Korean Congress may fail to approve its Chips Act amendment before deadline
Tax incentives promised for South Korean semiconductor companies by its version of the Chips Act may fall through the fingers.
Tuesday 26 March 2024
With HBM pie too tempting, could Micron sacrifice production capacity for other memory chips?
Micron Technology has seen its orders for High Bandwidth Memory (HBM) wait to be fulfilled throughout 2025.
Tuesday 26 March 2024
Samsung to build fully automated fabs with Nvidia Omniverse platform
Samsung is building a virtual fab
Tuesday 26 March 2024
Samsung likely to solely supply 12-layer HBM3E to Nvidia as early as September
Reports suggest that Samsung Electronics may soon become the sole supplier of 12-layer HBM products for Nvidia.
Monday 25 March 2024
Exclusive: Taiwan supply chain helps Micron to achieve early HBM3E mass production
Support from Taiwan's supply chain was behind US memory IDM Micron's successful mass production of its latest-generation high bandwidth memory (HBM) product – HBM3E –...
Monday 25 March 2024
SEMICON China shows mercury rising in US-China chip war
Chinese exhibitors went full native.
Monday 25 March 2024
Synopsys announces AI-driven EDA, IP and other solutions
Synopsys recently kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by company...
Monday 25 March 2024
Samsung advances towards 500-layer 3D NAND with V11 development
Samsung Electronics is intensifying its efforts in developing next-generation 3D NAND Flash technology.
Monday 25 March 2024
Weekly news roundup: Google to redefine smartphone connectivity with satellite integration in Pixel lineup
These are the most-read DIGITIMES Asia stories in the week of March 18 – March 22.
Monday 25 March 2024
Taiwan is new hunting ground for AI, tech intel
All roads lead to Taiwan.
Friday 22 March 2024
Samsung's AI accelerator reportedly cost one-tenth the price of Nvidia GPU
Samsung Electronics recently announced the launch of its self-developed Artificial Intelligence (AI) accelerator, MACH-1.
Friday 22 March 2024
Samsung and SK Hynix see memory businesses turn the corner in 2024
The South Korean memory industry is finally starting to recover.
Thursday 21 March 2024
Nvidia's Jensen Huang takes diplomatic rain check on Samsung's wafers
Huang showcased his diplomatic flair at Nvida's AI developers' conference.
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research