High-frequency microwave device maker Universal Microwave Technology (UMT) expects a ramp-up in demand for low Earth orbit (LEO) satellites to drive its growth in 2022.
Taiwan's epi-wafer supplier Intelligent Epitaxy Technology (IntelliEPI) has started taking orders for its high-performance GaN-based HEMT products, which are expected to serve as...
Taiwan-based foundries and IC design houses are looking to expand their presence in the automotive electronics sector, where chip demand is set to grow robustly, according to industry...
MediaTek will enter volume shipments of its new-generation 5G modem based on the latest 3GPP 5G R16 standard in 2022, gearing up for a boom in demand for flagship 5G smartphones,...
The global shortage of automotive ICs is likely to last beyond next year until 2023 or even 2024, and automakers worldwide are trying all possible means to counter, according to industry...
With the standards for the 5G protocols largely established, wireless communication providers in the US and Korea started to offer the service in select major cities starting third-quarter...
Taiwan's makers of RF and PA devices hope MediaTek can lead the local supply chain to meet competition from Qualcomm in tapping the mmWave 5G market, according to industry sources...
GaAs device and foundry company Transom expects military-use radars and other defense systems to emerge as niche application outlet for GaN-on-SiC RF components and modules including...
MixComm, a provider of millimeter-wave (mmWave) and front-end solutions for 5G and Satcom applications, has recently announced a collaboration with SiTune, an innovator of multiple...
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
