Samsung Electronics has introduced its newest radio frequency (RF) technology based on 8nm process. This cutting-edge foundry technology is expected to provide a "one chip solution,"...
Taiwan-based ACX, specializing in LTCC (low temperature co-fired ceramic) components for RF front-end modules, is set to complete a 40% capacity expansion in the third quarter, adding...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
More than 50% of Apple's next-generation iPhone devices slated for launch in the latter half of 2021 reportedly will support 5G mmWave technology, according to industry sources.
Most EV startups are expected to see their growth momentum dented by the increasing difficulty in obtaining foundry capacity support for chips they need, according to industry sour...
Chinese vendors have yet to release mmWave 5G models and corresponding infrastructure construction in China remains slow, according to industry sources.
Taiwan's III-V semiconductor players including foundry Win Semiconductors and epi-wafer supplier Visual Photonics Epitaxy (VPEC) have cut into the supply chains of major carmakers...
Smartphone-use antenna makers are gearing up for a likely boom in demand for 5G AiP (antenna in package) modules that they expect will be triggered by Apple's release of new mmWave-enabled...
IC testing interface solution provider Chunghwa Precision Test Tech (CHPT) expects probe card demand for all its targeted market segments to ramp up starting the second quarter of...
The chance of mmWave chips mounting a major challenge to the title of being the leading 5G mobile solutions will remain until at least the second half of 2022 due to tight capacity...
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Demand for mmWave AiP modules is set to pick up significantly in the second half of 2021 as Apple is expected to boost the adoption of such modules in its new Phones, which in turn...
Apple is stepping up development its own dual-band 5G AiP (antenna in package) module, which, along with Qualcomm's solutions, may be featured in its next-generation iPhones, according...
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
