mmWave radars and car-use cameras are necessary devices for ADAS and autonomous vehicles although they vary in degree of precision and computing capability, according to industry...
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
IC substrate maker Kinsus Interconnect Technology will build ABF substrate production lines at a plant it recently acquired from the bankrupt Chunghwa Picture Tubes (CPT) in Yangmei,...
Taiwan-based Cub Elecparts, dedicated to supplying ADAS and mmWave radar systems, reportedly has landed substantial orders from several China's state-run heavy-duty truck vendors...
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain of flexible MPI (modified...
Chunghwa Telecom (CHT), ASE Technology Holding and Qualcomm Technologies will join forces to build Taiwan's first smart factory based on 5G mmWave designated enterprise networks in...
MediaTek is expected to enter volume production of its mmWave 5G AiP (antenna in package) modules in 2021, and ASE Technology will provide backend support with its FC-AiP packaging...
Tests of 5G smartphone downlink speed in the US and UK by Ookla show that smartphones using the 5G millimeter wave bands, on average, achieve blazingly fast downlink speeds 20 times...
Taiwan has an opportunity to become a base for the development of mmWave technology, leveraging its established industry foundations, OEM/ODM technologies and related talent, according...
IC test interface solutions provider Chunghwa Precision Test Tech (CHPT) saw its revenues for the first seven months of 2020 jump 44.7% on year to NT$2.343 billion (US$79.69 million)...
Taiwan's flexible PCB maker Flexium Interconnect has disclosed its plant which is being constructed in Kaohsiung, southern Taiwan at a cost of NT$10 billion (US$333.33 million) will...
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
Cadence Design Systems and United Microelectronics (UMC) have jointly announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC's 28HPC+...
Apple's 2020 series of iPhones will work on both sub-6GHz and mmWave 5G networks, but there is a good chance that the vendor may introduce new models supporting either of the bands...
