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NEWS TAGGED MPI
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Friday 27 August 2021
Probe card provider MPI to acquire Celadon Systems
Taiwan's leading cantilever probe card maker MPI has announced it has entered into a definitive agreement to acquire US-based Celadon Systems, which specializes in ultra-high performance...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Monday 19 July 2021
FCCL maker Taiflex expects slight revenue growth in 2021
Taiwan-based FCCL specialist Taiflex Scientific has reiterated its revenue outlook this year of a slight increase compared to 2020.
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Friday 9 July 2021
Zhen Ding, Flexium to see strong shipments for new iPhones in 2H21
Flexible PCB specialists Zhen Ding Technology and Flexium Interconnect, reportedly among the suppliers of flexible antenna modules for the upcoming iPhones and other new Apple devices,...
Monday 5 July 2021
Iteq to develop high-end CCLs for handsets, IC substrates, mmWave antennas
Taiwan's CCL maker Iteq will step up its business diversification, with more efforts on developing high-end CCL materials for handset, IC substrate and flexible mmWave antenna applications,...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Friday 25 June 2021
Zhen Ding, Flexium enjoy strong Apple orders for antenna modules
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Wednesday 16 June 2021
Hermes Testing poised to tap cantilever probe card market
Hermes Testing Solutions (HTSI), a unit of chipmaking equipment supplier Hermes-Epitek, is poised to develop and manufacture cantilever probe cards with the technology already transferred...
Thursday 27 May 2021
IC test interface vendors keenly developing high-specs solutions for EV chips
IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other...
Thursday 29 April 2021
Flexium reportedly to volume ship LCP antennas for new iPhones in 2H21
Flexible PCB maker Flexium Interconnect is set to start volume shipments of LCP (liquid crystal polymer) antenna boards for new iPhones in the second half of the year, which will...
Tuesday 23 February 2021
IC testing service providers benefit from surging demand for cryptocurrencies
Surging prices of Ethereum has boosted demand for graphics cards used to mine the cryptocurrecny, which is benefiting Taiwan-based IC testing services providers, according to sources...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...