High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment and automotive...
As mmWave 5G phone market will see limited development momentum in 2020, shipments of flexible LCP (liquid crystal polymer) antenna boards for mmWave 5G smartphones are expected to...
Flexible copper-clad laminate (FCCL) supplier Taiflex Scientific has seen its manufacturing lines, located mainly in Taiwan, run at full capacity to meet accelerated shipment pull-in...
Taiwan-based polyimide (PI) film maker Taimide Tech, after seeing its revenues fall 22.4% on year to NT$1.76 billion (US$58.21 million) in 2019, is expected to regain growth momentum...
Taiwan-based flexible copper clad laminate (FCCL) supplier Taiflex, after registering revenue and profit falls for 2019, expects to resume growth momentum in 2020 with more shipments...
Flexible PCB specialist Flexium Interconnect has set aside a capex of NT$6.7 billion (US$260 million) for 2020, more than double the figure of NT$3 billion for 2019, aiming to strengthen...
Memory backend specialists have expressed optimism about demand for SSDs and other flash-based devices in 2020, while being upbeat about NAND flash chip prices this year.
Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those...
Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the...
Flexible PCB maker Flexium Interconnect has disclosed its September and third-quarter revenues improved significantly on year due mainly to strong demand for handset antenna boards,...
Taiwan PCB supply chain partners for Apple devices will be closely observing the first wave of sales performance for iPhone 11 series, which will directly affect their shipments in...
Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...
Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...
Taiwan-based IC designers, MCU suppliers and back-end packaging and testing service providers are all optimistic about the business opportunity brought by true wireless stereo (TWS)...
