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NEWS TAGGED NAND
Friday 24 September 2021
NAND flash contract prices to drop up to 5% in 4Q21, says TrendForce
NAND flash memory contract prices are expected to stay flat or drop by up to 5% in the fourth quarter of 2021, according to TrendForce.
Wednesday 22 September 2021
Highlights of the day: NAND chip supply may turn tight in 2H22
NAND flash pices may stablize in 2022, but supply is likely to turn tight in the second half of next year, according to Silicon...
Wednesday 22 September 2021
NAND supply likely to turn tight in 2H22, says Silicon Motion
NAND flash prices are expected to stay stable in 2022, but the supply of such chips is likely to turn tight in the second half of next year, according to Wallace Kou, president of...
Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Wednesday 15 September 2021
Global fab equipment spending to hit another record high in 2022, says SEMI
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion...
Monday 13 September 2021
Chipmakers gearing up for QLC NAND chip output ramp-up
Major NAND flash chip suppliers are poised to ramp up their output for QLC (quad-level cell) NAND chips between the end of this year and 2022, eyeing robust demand for not only PCs...
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Thursday 26 August 2021
Global NAND flash output value increases 10.8% in 2Q21, says TrendForce
The global NAND flash industry generated US$16.4 billion in output value in the second quarter of 2021, up 10.8% sequentially, according to TrendForce.
Tuesday 24 August 2021
YMTC sees low yield rates for 128-layer 3D NAND flash
China's Yangtze Memory Technologies (YMTC) continues to suffer from low yield rates for 128-layer 3D NAND flash manufacturing, which are estimated at only 30-40%, according to market...
Monday 23 August 2021
NAND flash market to regain balance in 2022, says Silicon Motion president
The global NAND flash memory market is expected to reach the balance of supply and demand in 2022, when the overall bit supply growth is expected to stay at about 30%, according to...
Wednesday 18 August 2021
Phison striving to secure supply commitments from NAND chip vendors
Phison Electronics is striving to strike deals with NAND flash chip providers for 2022 and finds it difficult to secure supply commitments from the memory chip vendors, according...
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Friday 6 August 2021
Foxconn gears up for automotive power IC boom
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Monday 2 August 2021
Macronix gearing up for ROM output ramp-up
Macronix International is gearing up for a substantial ramp-up in shipments of its ROM memory chips starting the third quarter of 2021, according to company president CY Lu.
Monday 2 August 2021
YMTC starts shipping 128-layer 3D NAND flash for China homegrown SSD
Yangtze Memory Technologies (YMTC) has kicked off mass production of 128-layer 3D NAND flash memory for a home-grown SSD series, according to industry sources.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.