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NEWS TAGGED NAND
Monday 2 December 2024
Samsung slashes photoresist usage in 3D NAND production, impacts supplier
Samsung Electronics has reportedly reduced its use of thick photoresist (PR) in the photolithography process for its latest 3D NAND flash, achieving significant cost savings. This...
Monday 2 December 2024
Kioxia's IPO set to reshape memory industry
Japanese NAND manufacturer Kioxia has secured approval for its initial public offering (IPO) on the Tokyo Stock Exchange, scheduled for December 18. South Korean SK Hynix may acquire...
Friday 29 November 2024
TeamGroup sees high-end memory demand pick up in 1Q25
Memory module maker TeamGroup anticipates heightened demand for high-end memory products in the first quarter of 2025, with low-end memory demand expected to follow suit in the second...
Thursday 28 November 2024
SK Hynix's NAND production reportedly accelerates, increasing competitive pressure on Samsung
SK Hynix has reportedly begun mass production of its 321-layer 1Tb TLC 3D NAND Flash products, posing a potential threat to Samsung Electronics' (Samsung) leading position. This development...
Thursday 21 November 2024
SK Hynix closes in on Samsung with NAND market share set to top 20%
SK Hynix's strategic focus on high-end NAND memory, coupled with rising AI-driven demand, is expected to push its annual market share above 20% in 2024, bringing it closer to industry...
Thursday 21 November 2024
SK Hynix starts mass production of world's first 321-high NAND
SK Hynix Inc. (or "the company", www.skhynix.com) announced today that it has started mass production of the world's first triple-level...
Wednesday 20 November 2024
Samsung reportedly to phase out MLC NAND production in 2025
Samsung Electronics will reportedly terminate its MLC NAND production by next year, shifting focus to high-capacity NAND production, according to industry sources.
Friday 15 November 2024
Trump 2.0 prompt SK Hynix and Samsung to weigh China exit plans
South Korea's semiconductor sector anticipates that Donald Trump's presidential victory could intensify restrictions on China's high-tech industries, particularly affecting the semiconductor...
Friday 15 November 2024
Samsung's Pyeongtaek P4 expands to NAND + DRAM; to host premier packaging facility in Cheonan
Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing...
Friday 15 November 2024
Adata continues dumping inventories until year-end
Memory module manufacturer Adata Technology anticipates memory contract prices will stay stable or see slight declines in the fourth quarter of 2024, with the company continuing to...
Wednesday 13 November 2024
Phison anticipates NAND tight supply in 2H25 as upstream manufacturers reduce production
Phison Electronics faced a 70% profit drop in the third quarter due to declining consumer demand and a substantial one-time loss. The company saw stable enterprise demands and a weak...
Tuesday 12 November 2024
Kioxia expects explosive demand for NAND, to introduce equipment to expand production
Kioxia, a Japanese NAND flash manufacturer, forecasts a 2.7-fold increase in NAND memory demand by 2028, driven by AI, which is expected to impact SSD prices significantly. The company's...
Thursday 7 November 2024
Kioxia begins K2 facility operations despite NAND market challenges
Kioxia has officially inaugurated its second building (K2) and a new management office at its Kitakami factory in Iwate Prefecture. While navigating through industry headwinds, the...
Monday 4 November 2024
Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Monday 4 November 2024
Samsung plans 400+ layer NAND and cutting-edge DRAM for 2026 to reclaim AI memory market
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research