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NEWS TAGGED NAND FLASH
Wednesday 27 October 2021
Macronix to scale up 3D NAND flash output in 2022
Macronix International expects to scale up substantially the output of its 48-layer 3D NAND flash memory in 2022, and is upbeat about its NOR flash chip prices that will continue...
Wednesday 20 October 2021
Highlights of the day: NAND flash price fall may worsen
Samsung's new NAND flash production capacity is coming, which is likely to create oversupply and exacerbate price falls...
Wednesday 20 October 2021
Samsung new NAND flash capacity coming online in 2H21 may worsen price falls
The gradual commercialization of Samsung Electronics's new production capacity for NAND flash memory in the second half of 2021 has sparked concerns among market observers about a...
Monday 18 October 2021
Commodity DRAM prices likely to fall 15-20% in 1Q22
Following peak shipments in the second and third quarters, the memory sector has entered a period of correction in the fourth quarter of 2021 that may last for 1-2 quarters, and commodity...
Monday 4 October 2021
NOR flash to remain tight through 2022
The supply of NOR flash memory has been relatively tight compared to that of DRAM and NAND flash memory, and is expected to remain short of demand through 2022, according to industry...
Monday 4 October 2021
Backend demand for commodity DRAM falls slightly in 4Q21
Backend service demand for commodity DRAM has dropped slightly, while that for NAND flash for enterprise SSDs and NOR flash for niche applications will stay relatively stable in the...
Friday 1 October 2021
Memory chipmakers under pressure to offload inventory
Memory chip vendors are increasingly under pressure to offload inventory, and have turned aggressive demanding downstream module houses to take delivery of chips starting September,...
Thursday 30 September 2021
Memory contract prices may see larger drops in 1Q22
PC DRAM contract prices are expected to fall about 10% in the fourth quarter of 2021, while contract prices for NAND flash memory will see slight drops. Prices for both DRAM and NAND...
Thursday 30 September 2021
Micron 1α DRAM, 176-layer NAND process yields reach maturity
Micron Technology has seen manufacturing yield rates for its 1α (1-alpha) DRAM and 176-layer NAND process nodes reach mature levels.
Wednesday 29 September 2021
Chip M&A deals reach US$22 billion in first 8 months of 2021
After a record-high start in the first quarter of 2021, semiconductor merger and acquisition announcements cool off a bit without the "megadeals" seen in 2020, according to IC Insi...
Wednesday 29 September 2021
QLC NAND could be adopted in 2022 iPhones
Apple is working with multiple NAND flash chipmakers to develop cost-effective QLC (quad-level cell) NAND flash solutions, and could adopt the memory in its iPhone series as early...
Friday 24 September 2021
NAND flash contract prices to drop up to 5% in 4Q21, says TrendForce
NAND flash memory contract prices are expected to stay flat or drop by up to 5% in the fourth quarter of 2021, according to TrendForce.
Wednesday 22 September 2021
NAND supply likely to turn tight in 2H22, says Silicon Motion
NAND flash prices are expected to stay stable in 2022, but the supply of such chips is likely to turn tight in the second half of next year, according to Wallace Kou, president of...
Wednesday 22 September 2021
YMTC ready to volume produce 128-layer QLC NAND flash
China-based Yangtz Memory Technologies (YMTC) has shipped over 300 million 64-layer 3D NAND flash memory chips and is ready to volume produce 128-layer QLC (quad-level cell) NAND,...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.