After a year of destocking, memory module providers are seeing rising prices from the third quarter. Notably, due to differences in applications, financial practices, and capital...
NAND flash spot prices have risen substantially since late July as memory chipmakers scale back output. Prices may experience a deceleration in growth in the first half of 2024 if...
Memory chip makers' strict production cuts have managed to shore up the NAND wafer prices, with module houses scrambling to secure supply, according to industry sources.
The memory market has shown signs of recovery, according to Peter Shu, chairman of memory module manufacturer Transcend Information. Memory chipmakers have purposefully limited their...
Samsung Electronics is making an extra effort to capture the opportunities brought by artificial intelligence while cutting losses in its semiconductor business. It is said to be...
In the third quarter of 2023, SK Hynix saw its DRAM business get out of the red thanks to increased demand for high-bandwidth memory (HBM) and DDR5. However, its NAND Flash business...
Memory spot prices for DRAM and NAND continue to pick up despite seasonal demand for the fourth quarter almost reaching an end, according to sources from the memory supply chain.
Memory chip manufacturers are preparing to beef up their offerings to meet rising demand triggered by generative AI being integrated into PCs and other terminal devices, according...
Yangtze Memory has developed 120-layer NAND flash memory as a "secret weapon" to circumvent US restrictions on the sales of 3D NAND with 128 layers or more to China, according to...
Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry,...
Phison Electronics, a specialist in NAND flash device controllers, is set to enter mass production of PCIe 5.0 retimer ICs in the first quarter of 2024, anticipating a surge in server...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
