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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 16 July 2024
TEL unveils open-source GenAI SSA at Semicon West 2024
Semicon West 2024 was held on July 9-11 in San Francisco, and Tokyo Electron Limited (TEL), the Japanese semiconductor equipment supplier, unveiled the world's first open-source generative...
Tuesday 16 July 2024
Smartphone replacement, automotive applications to boost CIS demand in 2H24
Anticipating a wave of smartphone replacements and growing demand for automotive applications, Taiwan-based backend houses are optimistic about the CMOS image sensor (CIS) sector...
Tuesday 16 July 2024
PCB shipments for LEO satellites to ramp up
Low Earth orbit (LEO) satellite services are reaching an ever-widening global user base as the space industry becomes increasingly commercialized. SpaceX's Starlink system has gained...
Monday 15 July 2024
China, US gaining ground in global IC substrate industry
Driven by emerging applications such as electric vehicles (EV), AI, and high-performance computing (HPC), IC substrates have attracted significant attention in the semiconductor industry...
Friday 12 July 2024
Shipment pull-ins for foldable smartphones from China strengthen
The strengthening of shipment pull-ins for foldable smartphones from China has buoyed related chip component suppliers' sales performance, according to industry sources.
Friday 12 July 2024
More Chinese PCB manufacturers set up plants in Thailand
Chinese PCB manufacturers are fueling an investment boom in Southeast Asia, particularly in Thailand, as they adapt to shifting global trade dynamics and seek demand beyond their...
Thursday 11 July 2024
Canadian robotic company Mecademic sees 50% CAGR in Asia-Pacific automation markets
Mecademic Industrial Robotics, a leader in micro-automation, is set to expand its presence in the high-growth medical devices and electronics markets, particularly in the Asia-Pacific...
Thursday 11 July 2024
GlobalFoundries advances SiPh tech amid data center interconnectivity demand optimism
GlobalFoundries (GF) is optimistic that silicon photonics (SiPh) will become a key growth area for the future data center market. In a recent interview with All About Circuits, Vikas...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Semiconductor manufacturing equipment growth to set new high in 2025: SEMI
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4%...
Wednesday 10 July 2024
US to invest up to US$1.6 billion to award domestic semiconductor advanced packaging R&D efforts
On July 9, the US Department of Commerce issued a Notice...
Wednesday 10 July 2024
Unimicron to expand high-end IC substrate market share
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Tuesday 9 July 2024
Taiwan seeks to alleviate labor shortage with relaxed residency regulations
To enhance corporate investment momentum in Taiwan and address talent shortages, Taiwan's National Development Council (NDC) said it is considering a system similar to Japan's "J-Skip"...
Tuesday 9 July 2024
SEMICON Taiwan 2024 to highlight AI as key driver of industry growth
As artificial intelligence (AI) continues to be a major driver of global semiconductor industry growth, SEMICON Taiwan 2024 is set to bring together industry leaders and visionaries...
Tuesday 9 July 2024
Passive component demand picking up, thanks to market recovery and AI
AI has been a driving force for Taiwan-based companies in relevant supply chains, boosting their profiles on the global stage.