Chinese exhibitors went full native.

Synopsys recently kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by company...

All roads lead to Taiwan.

China Steel Chemical Corporation (CSCC)recently developed 5N-grade high-purity carbon powder and graphite crucibles that have been adopted by Taiwanese compound semiconductor firms...

Taiwan Printed Circuit Association (TPCA) chairman Maurice Lee points to three main focuses for the industry in 2024.

Huang showcased his diplomatic flair at Nvida's AI developers' conference.

BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...

TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.

Topco Technologies is optimistic about the demand for heat-dissipation materials and silicone.

Merck views AI as the biggest driver of productivity growth in history, set to transform industries and reshape the world.

TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.

South Korean Flexible Printed Circuit Board (FPCB) manufacturer Siflex is set to join Apple's supply chain. Along with BH, it will supply Samsung Display (SDC) with Rigid flexible...

In the midst of the global Low Earth Orbit (LEO) satellite fervour, Taiwan's PCB industry is emerging as a pivotal player, mirroring the supply chains seen in the mobile phone and...

The UK's Arm has revealed an automotive processor.

Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If...