TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.

Topco Technologies is optimistic about the demand for heat-dissipation materials and silicone.

Merck views AI as the biggest driver of productivity growth in history, set to transform industries and reshape the world.

TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.

South Korean Flexible Printed Circuit Board (FPCB) manufacturer Siflex is set to join Apple's supply chain. Along with BH, it will supply Samsung Display (SDC) with Rigid flexible...

In the midst of the global Low Earth Orbit (LEO) satellite fervour, Taiwan's PCB industry is emerging as a pivotal player, mirroring the supply chains seen in the mobile phone and...